SHELLCASE Technology Provides High-Yield, Highly-Reliable Solutions for Image Sensors in Next-Generation Mobile Devices

SAN JOSE, Calif. & RABAT, Morocco--(BUSINESS WIRE)--April 29, 2008--Tessera Technologies, Inc. (Nasdaq:TSRA), a leading provider of miniaturization technologies for the electronics industry, and Nemotek S.A. today announced that Nemotek has licensed the SHELLCASE(R) MVP wafer-level chip-scale packaging (WLCSP) solution from Tessera. The SHELLCASE MVP solution, which Tessera announced on March 18, 2008, will enable Nemotek to provide original equipment manufacturers (OEMs) and camera module manufacturers with the ability to build smaller, thinner and more sophisticated consumer devices, such as camera phones, digital cameras, PDAs and laptops.

"With the licensing of Tessera's latest SHELLCASE MVP solution, Nemotek is once more showing its commitment to offering the best wafer-level packaging technology available to its customers," said Youssef Benmokhtar, director of marketing and business development, Nemotek. "We are making the transition from traditional packaging technology to the latest Through Silicon Via (TSV) wafer-level packaging technology possible by offering high-volume capabilities to image sensor makers around the world. Production ramp up of our SHELLCASE technology-based solutions will start in the first quarter of 2009."

The SHELLCASE MVP solution addresses market demand for more advanced technologies in image sensor packaging, including a thinner package, higher yield, enhanced reliability and lower cost. The new technology, which is one of the industry's first Through Silicon Via (TSV) solutions, provides manufacturers with the ability to develop thinner, more sophisticated consumer devices faster at a lower overall cost; it also complies with JEDEC Level 1 requirements, making it suitable for harsher applications such as automotive. The SHELLCASE MVP solution also enables manufacturers to utilize image sensor wafers without requiring any chip design modification, providing additional time and cost savings.

"We commend Nemotek for embracing the new Through Silicon Via technology we're offering in our SHELLCASE MVP packaging solution," said Bents Kidron, vice president of marketing, Wafer-Level Packaging, Tessera. "We believe that in licensing the SHELLCASE MVP technology, Nemotek is one step ahead of their competitors. Both Nemotek and their customers will reap the benefits of higher yield and lower production costs, which will be passed on in the form of cost savings throughout the manufacturing supply chain."

About SHELLCASE Technology

SHELLCASE wafer-level chip-scale packaging (WLCSP) technology provides high-yield, highly-reliable manufacturing solutions for image sensors used in next-generation mobile devices. The technology enables very low profile camera modules while significantly reducing assembly yield loss from contamination, providing OEMs with greater design flexibility and an innovative tool in the development of thinner mobile devices. The SHELLCASE RT solution enables one the thinnest, most cost-effective form factors for image sensor packaging with JEDEC Level 1 reliability, while the SHELLCASE CF solution provides a high-yield, low-cost alternative to traditional Chip on Board (CoB) packaging. The SHELLCASE MVP technology, one of the industry's first Through Silicon Via (TSV) solutions, supports 3D die-stacking of the image sensor with other ICs.

About Nemotek

Nemotek is the world's first licensee of both the SHELLCASE(R) and OptiML(TM) technologies from Tessera. The company provides a broad range of wafer-level packaging and consumer optics solutions, making it the best choice for wafer-level camera module manufacturing. Nemotek headquarters are located in Rabat, Morocco. For more information, please contact us at +212 3756 5044 or visit our website www.nemotek.ma.

About Tessera

Tessera Technologies, Inc. is a leading provider of miniaturization technologies for the electronics industry. The company provides a broad range of advanced packaging, interconnect, and consumer optics solutions which are widely adopted in high-growth markets including consumer, computing, communications, medical and defense electronics. Tessera's customers include the world's top semiconductor companies such as Intel, Samsung, Texas Instruments, Toshiba, Micron and Infineon. The company's stock is traded on the Nasdaq National Market under the symbol TSRA. Tessera is headquartered in San Jose, California. For information call 1.408.894.0700 or go to www.tessera.com.

Safe Harbor Statement

This press release contains forward-looking statements, which are made pursuant to the safe harbor provisions of the Private Securities Litigation Reform Act of 1995. Forward-looking statements involve risks and uncertainties that could cause actual results to differ significantly from those projected. Material factors that may cause results to differ from the statements made include delays, setbacks or losses relating to our intellectual property or intellectual property litigations, or any invalidation or limitation of our key patents; fluctuations in our operating results due to the timing of new license agreements and royalties, or due to legal costs; changes in patent laws, regulation or enforcement, or other factors that might affect our ability to protect our intellectual property; the risk of a decline in demand for semiconductor products; failure by the industry to adopt our technologies; competing technologies; the future expiration of our patents; the future expiration of our license agreements and the cessation of related royalty income; the failure or refusal of licensees to pay royalties; failure to achieve the growth prospects and synergies expected from acquisition transactions; and delays and challenges associated with integrating acquired companies with our existing businesses. You are cautioned not to place undue reliance on the forward-looking statements, which speak only as of the date of this release. Tessera's filings with the Securities and Exchange Commission, including its Annual Report on Form 10-K for the year ended December 31, 2007, include more information about factors that could affect the company's financial results.

Tessera, the Tessera logo and SHELLCASE are registered trademarks, and OptiML is a trademark of Tessera. All other company, brand and product names may be trademarks or registered trademarks of their respective companies.

CONTACT: Tessera
Julie Seymour, +1-408-383-3602
jseymour@tessera.com
or
JHG-Townsend for Tessera
Liya Sharif or Lori Scribner, +1-858-457-4888
Tessera_Team@jhg.com
or
Nemotek
Ali Elyazghi, +212-3756-5044
a.elyazghi@nemotek.ma

SOURCE: Tessera Technologies, Inc.