SAN JOSE, Calif.--(BUSINESS WIRE)--Dec. 1, 2004--Tessera
Technologies, Inc. (Nasdaq:TSRA), a leading technology developer,
licensor and product development services provider for semiconductor
chip-scale and multi-chip packages (CSPs and MCPs), will present at
the Raymond James IT Supply Chain Conference on Wednesday, December 8,
2004 at 1:30 p.m. Eastern Time at the Intercontinental The Barclay
Hotel in New York, NY. Presenting from management will be Bruce
McWilliams, chairman and chief executive officer, and Doug Norby,
senior vice president and chief financial officer.
A live webcast of the presentations will be available at
www.tessera.com. A replay of the presentation will be available on
Tessera's web site for 90 days.
About Tessera, Inc.
Tessera develops semiconductor packaging technology that meets the
demand for miniaturization and increased performance of electronic
products. Tessera licenses its technology to its customers, enabling
them to produce semiconductors that are smaller and faster, and
incorporate more features. These semiconductors are utilized in a
broad range of communications, computing and consumer electronic
CONTACT: Tessera, Inc.
Doug Norby, 408-894-0700
Mike Forman, 408-894-0700
Lippert/Heilshorn & Associates
Moriah Shilton/Kirsten Chapman, 415-433-3777 (IR)
SOURCE: Tessera Technologies, Inc.