SAN JOSE, Calif.--(BUSINESS WIRE)--Dec. 1, 2004--Tessera Technologies, Inc. (Nasdaq:TSRA), a leading technology developer, licensor and product development services provider for semiconductor chip-scale and multi-chip packages (CSPs and MCPs), will present at the Raymond James IT Supply Chain Conference on Wednesday, December 8, 2004 at 1:30 p.m. Eastern Time at the Intercontinental The Barclay Hotel in New York, NY. Presenting from management will be Bruce McWilliams, chairman and chief executive officer, and Doug Norby, senior vice president and chief financial officer.

A live webcast of the presentations will be available at www.tessera.com. A replay of the presentation will be available on Tessera's web site for 90 days.

About Tessera, Inc.

Tessera develops semiconductor packaging technology that meets the demand for miniaturization and increased performance of electronic products. Tessera licenses its technology to its customers, enabling them to produce semiconductors that are smaller and faster, and incorporate more features. These semiconductors are utilized in a broad range of communications, computing and consumer electronic products.

CONTACT: Tessera, Inc.
Doug Norby, 408-894-0700
Mike Forman, 408-894-0700
or
Lippert/Heilshorn & Associates
Moriah Shilton/Kirsten Chapman, 415-433-3777 (IR)
Moriah@lhai-sf.com

SOURCE: Tessera Technologies, Inc.