SAN JOSE, Calif.--(BUSINESS WIRE)--July 10, 2006--Tessera
Technologies, Inc. (Nasdaq:TSRA), a leading provider of
miniaturization technologies for the electronics industry, today
unveiled SHELLCASE(R) CF, a wafer-level technology for optical
components integrated into electronic products such as miniaturized
cameras in camera phones, digital still cameras and video camcorders.
Suitable for image sensors, certain types of MEMS and other
optical devices, Shellcase CF protects these components from
contamination from the initial stage of processing and is fully
compatible with conventional Chip-on-Board (COB) assembly processes.
An immediate targeted application of the technology is for CMOS and
CCD image sensors used in camera phones. For these applications,
Shellcase CF is engineered to provide up to a 40 percent improvement
in yield over existing COB technology. This yield improvement is
realized through the protection of the sensor's active area from
contamination and the ability to perform wafer-level image testing
prior to module assembly, both of which significantly improve camera
module yield and dramatically reduce overall cost.
Shellcase CF utilizes existing wire-bond assembly infrastructure
and processes, minimizing the hurdles to rapid adoption. With a
combination of high yield and low cost, the new wafer-level technology
platform delivers an extremely attractive solution that enables the
industry to cost-effectively meet the increasing demand for image
sensors in camera phones and other portable electronics.
Market research firm Techno Systems Research (TSR) forecasts that
the market for image sensors within camera phones is expected to
experience significant growth, increasing from approximately 413
million units in 2005 to 940 million units in 2009, representing a 23
percent compound annual growth rate (CAGR).
According to market research firm Prismark Partners, in 2005,
approximately 50 percent of image sensors were assembled using COB
technology. However, the trend toward higher quality pictures in
consumer electronics is presenting the industry with significant yield
challenges. To address these issues, many COB users will need to make
substantial investments in cleanroom infrastructure upgrades.
Shellcase CF provides a low-cost alternative that readily achieves
high yield and facilitates rapid adoption by utilizing existing
"Shellcase CF technology is based on Tessera's mature and widely
adopted Shellcase technology family," said Tom Pumo, senior
consultant, Prismark Partners. "Shellcase CF represents a clever
approach to solving image sensor yield issues that will become further
exacerbated as image resolution increases; as a result, this platform
is well positioned to meet the industry's emerging requirements."
Mike Bereziuk, Tessera's executive vice president, product
division, stated, "Shellcase CF illustrates our commitment to
developing new technologies that can help our customers and the
industry succeed. This new wafer-level platform cost-effectively
delivers high yields, independent of image sensor resolution or pixel
size, a key benefit for camera module manufacturers and others. We
look forward to working with our customer base as we introduce this
next-generation technology to the marketplace."
SHELLCASE CF Technology Overview
Shellcase CF is the newest addition to Tessera's Shellcase
wafer-level technology family and shares some similarities with COB
construction. However, unlike COB technology, Shellcase CF
encapsulates the image sensor, MEMS or other optical device with a
glass cover that is elevated from the silicon surface using cavity
walls. The cover design leaves the image sensor bond pads exposed
allowing for standard wire-bond assembly. The protected die is then
singulated and mounted to the board using standard die attach
processes. Shellcase CF also provides manufacturers the flexibility to
perform optical testing at the most favorable point of the assembly
flow, as defined by their specific requirements and manufacturing
environment. This flexibility helps to ensure high module assembly
Tessera is currently licensing this technology to interested
parties. In addition, Tessera is offering services, such as technology
transfer and training. Prototype samples for evaluation are available.
Shellcase CF is being showcased today, Monday, July 10, at
Tessera's annual U.S. Technology Symposium, at the Argent Hotel in San
Francisco, as well as at SEMICON West, Tuesday -- Thursday, July 11 --
July 13, at the Moscone Center, West Hall, booth #8622 in San
Francisco. For additional information, see Tessera's online media kit
at www.tessera.com or contact Tessera directly at 1-408-894-0700.
About Tessera Technologies, Inc.
Tessera Technologies is a leading provider of miniaturization
technologies for the electronics industry. Tessera enables new levels
of miniaturization and performance by applying its unique expertise in
the electrical, thermal and mechanical properties of materials and
interconnect. As a result, Tessera's technologies are widely adopted
in high-growth markets including consumer, computing, communications,
medical and defense. Tessera's customers include the world's top
semiconductor companies such as Intel, Samsung, Renesas, Toshiba and
Texas Instruments. The company's stock is traded on the Nasdaq
National Market under the symbol TSRA. Tessera is headquartered in San
Jose, California. www.tessera.com.
Safe Harbor Statement
This press release contains forward-looking statements, which are
made pursuant to the safe harbor provisions of the Private Securities
Litigation Reform Act of 1995. Forward-looking statements involve
risks and uncertainties that could cause actual results to differ
significantly from those projected. Factors that might cause or
contribute to such differences include, but are not limited to,
fluctuations in Tessera's operating results due to the timing of new
license agreements and royalties, Tessera's ability to protect its
intellectual property and the risk of a decline in demand for
semiconductor products. You are cautioned not to place undue reliance
on the forward-looking statements, which speak only as of the date of
this release. Tessera's filings with the Securities and Exchange
Commission, including its Annual Report on Form 10-K for the year
ended December 31, 2005, and its Quarterly Report on Form 10-Q filed
for the quarter ended March 31, 2006 include more information about
factors that could affect the company's financial results.
Note: Tessera, Shellcase and the Tessera logo are registered
trademarks of Tessera, Inc. All other company, brand and product names
may be trademarks or registered trademarks of their respective
Daryl Larsen, 408-952-4364
Mark Plungy, 408-369-4600 ext. 675
SOURCE: Tessera Technologies, Inc.