µPILR Interconnect Platform Improves Semiconductor Packaging Size, Performance and Reliability
SAN JOSE, Calif.--(BUSINESS WIRE)--Feb. 10, 2009-- Tessera Technologies, Inc. (Nasdaq:TSRA) today announced that Kinsus Interconnect Technology Corp. has licensed Tessera’s µPILR™ interconnect platform, which reduces semiconductor packaging size while enhancing performance and reliability. Under the terms of the agreement, Taiwan-based Kinsus, a leading provider of IC package substrates, will manufacture and sell substrates based on the µPILR technology.
The µPILR interconnect platform improves and simplifies interconnections within semiconductor packages, substrates, printed circuit boards (PCBs) and other electronic components. The innovative technology reduces the total form factor in the stacking of logic plus memory, flash and DRAM by using low profile, pin-shaped contacts to replace conventional interconnect technologies, such as solder balls on semiconductor packages. The µPILR technology enables contacts which are up to 50 percent smaller in diameter and height over solder balls. These shorter connections increase electrical and thermal performance, delivering high density routing between contacts for increased functionality within the same package footprint.
“We offer advanced technology manufacturing services and provide a complete portfolio of IC package substrates, tailored to the specific needs of our customers,” said Peter Kuo, president, Kinsus Interconnect Technology Corp. “With Tessera’s µPILR interconnect platform, we have expanded our IC package substrate offerings to bring our customers even greater choice and superior value.”
“Tessera revolutionized the semiconductor industry with our development of chip-scale package (CSP) technology, and is now breaking new ground with our advanced µPILR interconnect technology,” said Craig Mitchell, senior vice president, Interconnect, Components and Materials (ICM), Tessera. “By addressing the technical limitations of current interconnect solutions, we believe our µPILR platform will become a fundamental building block in next-generation wireless, computing and consumer electronic products by enabling greater levels of integration and functionality.”
µPILR Interconnect Platform
A semiconductor package is the physical and electrical interface between a semiconductor chip and the system in which it operates. Tessera's µPILR interconnect platform leverages existing assembly processes and infrastructure to enable rapid integration into next-generation electronics. µPILR pins can be used as internal or external interconnections in a variety of applications, including the interconnection between semiconductor die and package substrates, semiconductor packages and printed circuit boards (PCBs), as well as the layers within package substrates and PCBs.
The µPILR technology can accommodate a broad range of semiconductor devices, from small die with low I/O to large die with high I/O. Devices can be packaged in single-chip, multi-chip, package-on-package and other configurations. Specific device applications include flash, DRAM, SRAM, application processors and baseband processors, as well as other logic devices. In addition, the platform readily addresses the challenges associated with the package level integration of logic plus memory. The ability to test and burn-in each individual package before stacking enables near 100 percent stacked yields. The highly co-planar aspect of the µPILR pins minimizes the complex warpage issues commonly experienced in package-on-package (PoP) configurations.
Tessera Technologies, Inc. delivers miniaturization technologies that transform electronic products. The company’s packaging and interconnect solutions enable smaller, higher-functionality electronic devices. Tessera’s imaging and optics solutions provide low-cost, high-quality camera functionality in electronic products and include image sensor packaging, wafer-level optics and image enhancement intellectual property. The company also offers customized micro-optic lenses, from diffractive and refractive optical elements to integrated micro-optical subassemblies. Tessera licenses its technologies, as well as delivers products based on these technologies, to promote the development of the supply chain infrastructure. The company is headquartered in San Jose, California. For information call 1.408.321.6000 or go to www.tessera.com.
Safe Harbor Statement
This press release contains forward-looking statements, which are made pursuant to the safe harbor provisions of the Private Securities Litigation Reform Act of 1995. Forward-looking statements involve risks and uncertainties that could cause actual results to differ significantly from those projected, particularly with respect to the execution of activities covered by any agreements between Tessera and Kinsus, the features and performance of any Kinsus products or Tessera technologies, and the impact of products and technologies on their respective markets. Material factors that may cause results to differ from the statements made include delays, setbacks or losses relating to our intellectual property or intellectual property litigations, or any invalidation or limitation of our key patents; fluctuations in our operating results due to the timing of new license agreements and royalties, or due to legal costs; changes in patent laws, regulation or enforcement, or other factors that might affect our ability to protect our intellectual property; the risk of a decline in demand for semiconductor products; failure by the industry to adopt our technologies; competing technologies; the future expiration of our patents; the future expiration of our license agreements and the cessation of related royalty income; the failure or refusal of licensees to pay royalties; failure to achieve the growth prospects and synergies expected from acquisition transactions; and delays and challenges associated with integrating acquired companies with our existing businesses. You are cautioned not to place undue reliance on the forward-looking statements, which speak only as of the date of this release. Tessera's filings with the Securities and Exchange Commission, including its Annual Report on Form 10-K for the year ended December 31, 2007 and its Quarterly Report on Form 10-Q for the quarter ended Sept. 30, 2008, include more information about factors that could affect the company's financial results.
Tessera, the Tessera logo and µPILR are trademarks or registered trademarks of Tessera Inc. or its affiliated companies in the United States and other countries. All other company, brand and product names may be trademarks or registered trademarks of their respective companies.
Source: Tessera Technologies, Inc.
Judy Erkanat, +1-408-321-6751
LEWIS PR for Tessera
Catherine Koo / Nicole Wasowski, +1-415-992-4400