SAN JOSE, Calif., Feb 18, 2010 (BUSINESS WIRE) -- Tessera Technologies, Inc. (Nasdaq:TSRA) announced that its
semiconductor packaging subsidiary, Tessera, Inc., has signed a
technology licensing agreement with Nanium, S.A. Nanium, formerly known
as Qimonda Portugal, previously was the largest semiconductor packaging
assembly and test operation within Qimonda. Nanium has now reorganized
as an independent company and will focus on providing assembly and test
services for the DRAM memory market and other semiconductor products.
Products manufactured by Nanium will be incorporated into computers,
servers and various electronic devices such as MP3 players, mobile
phones, photographic cameras and game consoles. The initial term of the
license agreement runs through the end of 2017.
"Our packaging technologies are foundational elements for the DRAM
industry, and will be for many years," said Henry R. Nothhaft, chairman
and chief executive officer, Tessera. "In addition to licensing
Tessera's innovative chip scale packaging technologies, Nanium has
licensed a broad range of Tessera's packaging portfolio. As a result, it
will be able to offer its customers an extensive variety of
Tessera-enabled packages and technologies to fit their needs, including
flip chip, stacked-die, and stacked package configurations."
"Having access to Tessera's packaging technologies will allow us to grow
and serve customers in the DRAM market and throughout the semiconductor
industry," said Armando Tavares, Nanium's president of the Executive
Board. "We can now offer our customers leading edge, licensed
technologies to enable their products and businesses."
Under the agreement, Nanium has licensed Tessera's semiconductor
packaging technology covering a broad range of chip scale, multi chip
and flip chip package types. These technologies include integrated
circuit devices packaged in "face-down," "face-up," "stacked-die,"
"package on package," "system-in-package," and "flip chip" formats,
utilizing many different types of materials, including packages using
either tape- or laminate-based package substrates.
Safe Harbor Statement
This press release contains forward-looking statements, which are made
pursuant to the safe harbor provisions of the Private Securities
Litigation Reform Act of 1995. Forward-looking statements involve risks
and uncertainties that could cause actual results to differ
significantly from those projected, particularly with respect to
Nanium's use of Tessera's technology, the extent and duration of
enablement by Tessera's technology, and industry and technology trends.
Material factors that may cause results to differ from the statements
made include delays, setbacks or losses relating to our intellectual
property or intellectual property litigations, or any invalidation or
limitation of our key patents; fluctuations in our operating results due
to the timing of new license agreements and royalties, or due to legal
costs; changes in patent laws, regulation or enforcement, or other
factors that might affect our ability to protect our intellectual
property; the risk of a decline in demand for semiconductor products;
failure by the industry to adopt our technologies; competing
technologies; the future expiration of our patents; the future
expiration of our license agreements and the cessation of related
royalty income; the failure or refusal of licensees to pay royalties;
failure to achieve the growth prospects and synergies expected from
acquisition transactions; and delays and challenges associated with
integrating acquired companies with our existing businesses. You are
cautioned not to place undue reliance on the forward-looking statements,
which speak only as of the date of this release. Tessera's filings with
the Securities and Exchange Commission, including its Annual Report on
Form 10-K for the year ended Dec. 31, 2008 and its Quarterly Report on
Form 10-Q for the quarter ended Sept. 30, 2009, include more information
about factors that could affect the company's financial results. Tessera
assumes no obligation to update information contained in this press
release. Although this release may remain available on Tessera's website
or elsewhere, its continued availability does not indicate that Tessera
is reaffirming or confirming any of the information contained herein.
Tessera Technologies, Inc. invests in, licenses and delivers innovative
miniaturization technologies for next-generation electronic devices. The
company's micro-electronics solutions enable smaller,
higher-functionality devices through chip-scale, 3D and wafer-level
packaging technology, as well as high-density substrate and silent air
cooling technology. Tessera's imaging and optics solutions provide
low-cost, high-quality camera functionality in electronic products and
include image sensor packaging, wafer-level optics and image enhancement
intellectual property. The company also offers customized micro-optic
lenses, from diffractive and refractive optical elements to integrated
micro-optical subassemblies. Tessera licenses its technologies, as well
as delivers products based on these technologies, to promote the
development of the supply chain infrastructure. The company is
headquartered in San Jose, California. For information call
1.408.321.6000 or go to www.tessera.com.
Tessera and the Tessera logo are trademarks or registered trademarks of
Tessera, Inc. or its affiliated companies in the United States and other
countries. All other company, brand and product names may be trademarks
or registered trademarks of their respective companies.
SOURCE: Tessera Technologies, Inc.
Tessera Technologies, Inc.
Michael Anthofer, 408-321-6711
Chief Financial Officer
Investor Relations Contact:
Moriah Shilton, 408-321-6713
Sr. Director, Investor Relations
Copyright Business Wire 2010