Industry Experts Explore the Future of System-in-Packaging Technologies and Emerging Electronics
SAN JOSE, Calif.--(BUSINESS WIRE)--June 29, 2004-- Tessera Technologies, Inc. (Nasdaq:TSRA), a leading technology developer and services provider for semiconductor chip-scale and multi-chip packages (CSPs and MCPs), today provided further details of the agenda for its 2004 System-in-Package Symposium (SiP), to be held Tuesday, July 13, 2004, at the Hyatt Sainte Claire Hotel in San Jose, California. This prominent forum will feature leading technologists exploring how the semiconductor industry can develop low-cost, small-size, high-performing electronic products and systems using advanced SiP technologies.
Dr. David Tuckerman, Tessera's chief technical officer, will open the half-day symposium with a discussion on how to lower the risks associated with SiP implementation. The following industry experts join Tuckerman on the roster:
- Jim Walker, vice president of research at Gartner Dataquest, will discuss market trends, applications and analysis for multiple-die packaging.
- Intel's Steve Greathouse, non CPU pathfinding program manager, will examine stacked die and system-in-package applications.
- Mike Steidl, Amkor Technology's senior vice president of advanced product development, will discuss the latest in SiP package solutions.
- SMART Modular's Arthur Sainio, senior strategic marketing manager, will explore the advantages and economics of stacking high performance memory.
- Nokia's Dr. Viswanadham Puligandla, principal scientist, Nokia research center, will outline the road to reliable lead-free consumer bound electronics.
- A special report on the changing requirements for package substrates will be provided by Jan Vardaman, president, TechSearch International.
- Larry Czapla, senior vice president of the medical business group at PEMSTAR Medical, will examine enabling solutions for miniature medical electronic applications.
- Tessera's Craig Mitchell, vice president of marketing, will discuss the benefits of system-level integration and miniaturization.
- Gene Selven, publisher of ChipScale Review Magazine, will provide closing comments.
Tessera and Chip Scale Review Magazine have teamed to sponsor this Symposium, which will be held the week of SEMICON West, on Tuesday, July 13, at the Hyatt Sainte Claire Hotel, across the street from the San Jose Convention Center. The half-day symposium will run from 1:00-5:30 p.m., followed by a reception from 5:30-7:00 p.m. Last year's event was standing room only, so interested attendees are encouraged to register early at www.tessera.com. For additional information, contact Daryl Larsen, symposium event manager, at 408-952-4364 or email@example.com.
Tessera develops semiconductor packaging technology that meets the demand for miniaturization and increased performance of electronic products. Tessera licenses its technology to its customers, enabling them to produce semiconductors that are smaller and faster, and incorporate more features. These semiconductors are utilized in a broad range of communications, computing and consumer electronic products.
Safe Harbor Statement
This press release contains forward-looking statements, which are made pursuant to the safe harbor provisions of the Private Securities Litigation Reform Act of 1995. Forward-looking statements involve risks and uncertainties that could cause actual results to differ significantly from those projected. Factors that might cause or contribute to such differences include, but are not limited to, fluctuations in Tessera's operating results due to the timing of new license agreements and royalties, Tessera's ability to protect its intellectual property and the risk of a decline in demand for semiconductor products. You are cautioned not to place undue reliance on the forward-looking statements, which speak only as of the date of this release. Tessera's filings with the Securities and Exchange Commission, including its Annual Report on Form 10-K for the year ended December 31, 2003, include more information about factors that could affect the company's financial results.
Note: Tessera, MicroBGA, Compliant Chip and the Tessera logo are registered trademarks and MicroZ is a trademark of Tessera, Inc. All other company, brand and product names may be trademarks or registered trademarks of their respective companies.
CONTACT: Tessera Public Relations
Joyce Smaragdis, 510-338-0377
Porter Novelli, for Tessera
Ricky Gradwohl, 408-369-1500 x631