SAN JOSE, Calif.--(BUSINESS WIRE)--
Invensas Corporation, a wholly owned subsidiary of Tessera Technologies,
Inc. (Nasdaq: TSRA), has validated high performance DDR3 registered dual
inline memory modules (RDIMMs) incorporating its dual face down (DFD)
packaging technology with Montage Technology's advanced register
M88SSTE32882-H0 clock driver chip.
DFD is a dual die implementation of Invensas' multi-face down (xFDTM)
packaging technology platform. xFD technology meets data center server
DRAM requirements by delivering a denser, faster, more cost-effective
packaging solution which can be produced using existing manufacturing
processes. In addition, a 20 to 30 percent reduction in thickness and a
thermal transfer improvement of 20 to 30 percent provides an optimized
platform for a range of DRAM memory modules.
Safe Harbor Statement
This media alert contains forward-looking statements, which are made
pursuant to the safe harbor provisions of the Private Securities
Litigation Reform Act of 1995. Forward-looking statements involve risks
and uncertainties that could cause actual results to differ
significantly from those projected, particularly with respect to the
features, characteristics and benefits of Invensas' xFD technology.
Material factors that may cause results to differ from the statements
made include delays, setbacks or losses relating to Tessera
Technologies, Inc.'s (the "Company" or "Tessera") intellectual property
or intellectual property litigations, or any invalidation or limitation
of the Company's key patents; fluctuations in the Company's operating
results due to the timing of new license agreements and royalties, or
due to legal costs; changes in patent laws, regulation or enforcement,
or other factors that might affect the Company's ability to protect its
intellectual property; the risk of a decline in demand for semiconductor
products; failure by the industry to adopt the Company's technologies;
competing technologies; the future expiration of the Company's patents;
the future expiration of the Company's license agreements and the
cessation of related royalty income; the failure or refusal of licensees
to pay royalties; failure to achieve the growth prospects and synergies
expected from acquisition transactions; and delays and challenges
associated with integrating acquired companies with the Company's
existing businesses. You are cautioned not to place undue reliance on
the forward-looking statements, which speak only as of the date of this
media alert. Tessera's filings with the Securities and Exchange
Commission, including its Annual Report on Form 10-K for the year ended
December 31, 2010 and its Quarterly Report on Form 10-Q for the quarter
ended June 30, 2011, include more information about factors that could
affect the Company's financial results. Tessera assumes no obligation to
update information contained in this media alert. Although this media
alert may remain available on Tessera's and Invensas' website or
elsewhere, its continued availability does not indicate that Tessera is
reaffirming or confirming any of the information contained herein.
About Invensas Corporation
Invensas Corporation, a wholly owned subsidiary of Tessera Technologies,
Inc. (Nasdaq: TSRA), acquires, develops and monetizes strategic
intellectual property (IP) in areas such as, circuitry design, 3-D
systems, memory modules and other enabling technologies, to serve the
dynamic mobile, storage and consumer electronics sectors. Invensas' IP
portfolio includes approximately 280 patents and patent applications.
The group is headquartered in San Jose, California. For information call
1.408.321.6000 or go to www.invensas.com.
Invensas and the Invensas logo are trademarks of Invensas Corporation or
its affiliated companies in the United States and other countries. All
other company, brand and product names may be trademarks or registered
trademarks of their respective companies.
TSRA-G
Invensas Corporation
Judy Erkanat, +1-408-321-6751
pr@invensas.com
Source: Invensas Corporation
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