SAN JOSE, Calif.--(BUSINESS WIRE)-- Invensas Corporation, a wholly owned subsidiary of Tessera Technologies, Inc. (Nasdaq:TSRA), will be presenting on the latest advances in memory packaging technology at the International Semiconductor Manufacturing and Packaging (ISMP) conference, to be held October 12-13, 2011, in Seoul, Korea.

WHO:		Richard Crisp, Vice President and Chief Technologist, Invensas Corporation
WHAT:		High Performance Multi-Die DRAM Packaging for High-Speed Server Applications Using Dual Face Down (DFD) Architecture with Wirebond Assembly Infrastructure
WHERE:		ISMP 2011
		The Korea Science and Technology Center (KSTC)
		#505 Main Bldg.
		Seoul, Korea
WHEN:		October 12, 2011
		9:10-9:50am

Safe Harbor Statement

This media alert contains forward-looking statements, which are made pursuant to the safe harbor provisions of the Private Securities Litigation Reform Act of 1995. Forward-looking statements involve risks and uncertainties that could cause actual results to differ significantly from those projected, particularly with respect to Invensas' participation at the International Semiconductor Manufacturing and Packaging conference, as well as the subject matter of the Invensas presentations at the conference. Material factors that may cause results to differ from the statements made include delays, setbacks or losses relating to Tessera Technologies, Inc.'s (the "Company" or "Tessera") intellectual property or intellectual property litigations, or any invalidation or limitation of the Company's key patents; fluctuations in the Company's operating results due to the timing of new license agreements and royalties, or due to legal costs; changes in patent laws, regulation or enforcement, or other factors that might affect the Company's ability to protect its intellectual property; the risk of a decline in demand for semiconductor products; failure by the industry to adopt the Company's technologies; competing technologies; the future expiration of the Company's patents; the future expiration of the Company's license agreements and the cessation of related royalty income; the failure or refusal of licensees to pay royalties; failure to achieve the growth prospects and synergies expected from acquisition transactions; and delays and challenges associated with integrating acquired companies with the Company's existing businesses. You are cautioned not to place undue reliance on the forward-looking statements, which speak only as of the date of this media alert. Tessera's filings with the Securities and Exchange Commission, including its Annual Report on Form 10-K for the year ended Dec. 31, 2010 and its Quarterly Report on Form 10-Q for the quarter ended June 30, 2011, include more information about factors that could affect the Company's financial results. Tessera assumes no obligation to update information contained in this media alert. Although this media alert may remain available on Tessera's and Invensas' website or elsewhere, its continued availability does not indicate that Tessera is reaffirming or confirming any of the information contained herein.

About Invensas Corporation

Invensas Corporation, a wholly owned subsidiary of Tessera Technologies, Inc. (Nasdaq: TSRA), acquires, develops and monetizes strategic intellectual property (IP) in areas such as circuitry design, 3-D systems, memory modules and other enabling technologies to serve the dynamic mobile, storage and consumer electronics sectors. Invensas' IP portfolio includes approximately 280 patents and patent applications. The group is headquartered in San Jose, California. For information call 1.408.321.6000 or go to www.invensas.com.

Invensas and the Invensas logo are trademarks of Invensas Corporation or its affiliated companies in the United States and other countries. All other company, brand and product names may be trademarks or registered trademarks of their respective companies.

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Invensas Corporation
Judy Erkanat, +1-408-321-6751
pr@invensas.com

Source: Invensas Corporation

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