SAN JOSE, Calif., Nov 11, 2004 (BUSINESS WIRE) -- Tessera Technologies, Inc. (Nasdaq:TSRA), a leading technology developer, licensor and product development services provider for semiconductor chip-scale and multi-chip packages (CSPs and MCPs), announced today that it will present at the 2004 Lehman Brothers Small Cap Conference on November 19, 2004 at 8:00 a.m. MST at The Phoenician in Scottsdale, Arizona. Presenting from management will be Doug Norby, senior vice president and chief financial officer.

A live webcast of the presentation will be available at www.tessera.com. A replay of the presentation will also be available on Tessera's web site for 90 days.

About Tessera

Tessera develops semiconductor packaging technology that meets the demand for miniaturization and increased performance of electronic products. Tessera licenses its technology to its customers, enabling them to produce semiconductors that are smaller and faster, and incorporate more features. These semiconductors are utilized in a broad range of communications, computing and consumer electronic products.

SOURCE: Tessera Technologies, Inc.

Tessera Technologies, Inc.
Doug Norby or Mike Forman, 408-894-0700
or
Lippert / Heilshorn & Associates (Investor Relations)
Moriah Shilton, 415-433-3777
Moriah@lhai-sf.com
Kirsten Chapman, 415-433-3777