SAN JOSE, Calif., Nov 11, 2004 (BUSINESS WIRE) -- Tessera
Technologies, Inc. (Nasdaq:TSRA), a leading technology developer,
licensor and product development services provider for semiconductor
chip-scale and multi-chip packages (CSPs and MCPs), announced today
that it will present at the 2004 Lehman Brothers Small Cap Conference
on November 19, 2004 at 8:00 a.m. MST at The Phoenician in Scottsdale,
Arizona. Presenting from management will be Doug Norby, senior vice
president and chief financial officer.
A live webcast of the presentation will be available at
www.tessera.com. A replay of the presentation will also be available
on Tessera's web site for 90 days.
Tessera develops semiconductor packaging technology that meets the
demand for miniaturization and increased performance of electronic
products. Tessera licenses its technology to its customers, enabling
them to produce semiconductors that are smaller and faster, and
incorporate more features. These semiconductors are utilized in a
broad range of communications, computing and consumer electronic
SOURCE: Tessera Technologies, Inc.
Tessera Technologies, Inc.
Doug Norby or Mike Forman, 408-894-0700
Lippert / Heilshorn & Associates (Investor Relations)
Moriah Shilton, 415-433-3777
Kirsten Chapman, 415-433-3777