Symposium to Feature Japanese and U.S. Semiconductor Companies at
the Forefront of Advanced Electronics Packaging
SAN JOSE, Calif.--(BUSINESS WIRE)--Jan. 5, 2005-- Tessera Technologies, Inc. (Nasdaq:TSRA), a leading technology
developer, licensor and product development services provider for
semiconductor chip-scale and multi-chip packages (CSPs and MCPs),
today provided further details of the agenda for its first annual
System-in-Package (SiP) Symposium in Tokyo, Japan, to be held on
Tuesday, January 18, 2005 at the Le Meridien Grand Pacific Hotel. This
highly educational forum will feature leading Japanese and U.S.-based
companies who are extending the boundaries of electronics
miniaturization and enhanced performance through advanced electronics
Dr. David Tuckerman, Tessera's chief technical officer, will open
the half-day symposium with a discussion on lowering the risk of SiP
implementation. The following industry experts join Tuckerman on the
- Henry Utsunomiya, president of Interconnection Technologies,
will discuss market trends, applications and analysis for
multiple die packaging.
- Tessera's Craig Mitchell, vice president of marketing, will
explore the benefits and challenges of a new design
methodology, SLIM, for system level integration and
- Gordon Jensen, president of CAD Design Software, will discuss
the latest stacked die and 3D automated design tools.
- Kimitaka Endo, manager of the R&D division at North, will
examine high density substrates with copper bumps.
- Hitachi Cable's Hiroyuki Okabe, technical manager of the
2-metal flexible substrate development group at Hitachi Cable,
will discuss flexible substrate solutions for SiPs.
- Spansion's Junichi Kasai, vice president of final
manufacturing R&D, will review issues and solutions facing 3D
- Elpida Memory's Ichiro Anjo, senior manager, production
engineering department, will explore the topic of advanced
packaging for high-performance DRAM.
- IBM's Jonathan Hinkle, design engineer, will discuss the usage
of stacked packaging solutions for blade server applications.
- Joseph Fjelstad, co-founder of Silicon Pipe, will examine the
topic of emerging trends in advanced IC packaging and
interconnection for high speed applications, present and
- Kenji Tsuda, editor of Semiconductor International Japan, will
provide closing comments.
Tessera and Semiconductor International Japan have teamed to
sponsor the Symposium, which will take place on Tuesday, January 18,
the day before the opening of the IC Packaging Technology Expo (ICP)
in Japan. The half-day symposium will run from 1:00-5:30 p.m.,
followed by a reception from 5:30-7:00 p.m. Pre-registration is
requested and encouraged for those who would like to secure attendance
to the event. Attendees can register at www.tessera.com. For
additional information, contact Daryl Larsen, symposium event manager,
at 408-952-4364 or firstname.lastname@example.org.
About Tessera, Inc.
Tessera develops semiconductor packaging technology that meets the
demand for miniaturization and increased performance of electronic
products. Tessera licenses its technology to its customers, enabling
them to produce semiconductors that are smaller and faster, and
incorporate more features. These semiconductors are utilized in a
broad range of communications, computing and consumer electronic
Safe Harbor Statement
This press release contains forward-looking statements, which are
made pursuant to the safe harbor provisions of the Private Securities
Litigation Reform Act of 1995. Forward-looking statements involve
risks and uncertainties that could cause actual results to differ
significantly from those projected. Factors that might cause or
contribute to such differences include, but are not limited to,
fluctuations in Tessera's operating results due to the timing of new
license agreements and royalties, Tessera's ability to protect its
intellectual property and the risk of a decline in demand for
semiconductor products. You are cautioned not to place undue reliance
on the forward-looking statements, which speak only as of the date of
this release. Tessera's filings with the Securities and Exchange
Commission, including its Annual Report on Form 10-K for the year
ended December 31, 2003, include more information about factors that
could affect the company's financial results.
Note: Tessera and the Tessera logo are registered trademarks of
Tessera, Inc. All other company, brand and product names may be
trademarks or registered trademarks of their respective companies.
Joyce Smaragdis, 510-338-0377
Porter Novelli, for Tessera
Ricky Gradwohl, 408-369-1500 ext. 631
SOURCE: Tessera Technologies, Inc.