Mobile Memory & Logic + Memory Stacking

The µPILR advantages of space saving and performance are realized with Mobile Memory & Logic + Memory stacking in mobile electronics. As the customer demand increases for more functionality, so does the demand for a wide spectrum of memory and logic to be packaged in small areas while still maintaining performance, reliability and OEM flexibility to quickly change configurations. Reduced package pitch with µPILR can enable smaller package footprints to help save space in handheld products and the improved lead-free drop test reliability results seen with µPILR are a key benefit of this interconnect technology.

Package-on-Package Applications and Products

• Digital audio players (MP3 etc.)
• Portable media players
• Cell phone
• Handheld games
• Digital still cameras
• DSP, ASIC + memory

For more information about the company's portfolio of image enhancement technologies, please email info@tessera.com.